PolyStrata: 3D air-dieletric interconnection and packaging technology
Nuvotronics patented PolyStrata microfabrication process is the first manufacturing technology to deliver 3D printed copper air-dielectric interconnection and packaging to create mmWave devices with unprecedented levels of RF performance, integration, density, and miniaturization, with a 10x to 100x improvement in size, weight, and power (SWaP). The micro-coaxial structures created by the PolyStrata process produce mmWave and microwave devices with ultra-low losses, superior isolation, improved thermal chaaracteristics, and ultra-high frequency performance.
Enable unprecedented design capabilities with repeatable precision and performance
The unique PolyStrata microfabrication process gives design engineers the unprecedented ability to create complex 3D miniature circuit components using 3D CAD software and transfer those designs directly to manufacturing equipment, resulting in mass-produced devices with repeatable micron-level precision and superior high frequency performance. The incredible repeatability enables multiple components to be combined with predictable results and performance. Complex solutions for phased arrays, compact front end, and multiplexers have all been successfully manufactured.
Ideal applications:
- Power amplifiers 15 GHz or above 20W output power
- Low Noise Amplifiers – 15 GHz and above
- Multi-Chip Modules
- Antenna Integrated Package
Proven technology that shortens time to market
We have 16 years of proven expertise to design, build, and manufacture products compatible with standard, wire bonding, pick-and-place, & SMT assembly. The technology can realize most transmission line circuits with an advanced degree of accuracy and precision to enable first pass design success.
The PolyStrata process
In the PolyStrata process, Nuvotronics’ proprietary photoresist material is deposited on a substrate to form structural molds for electroplated copper layers (from 10µm to 100µm), which are then planarized multiple times as layers are added. To support the center copper conductor of the coax, thin low-loss dielectric straps are embedded in the metal layers. After the structure is complete, the photoresist mold material is removed using Nuvotronics’ proprietary release method, leaving a 3D air-dielectric structure that can be left on the substrate, or chemically released to be attached to another substrate. All of the PolyStrata® process steps are performed below 150°C, so they can be built on completed wafers. The resulting devices feature unparalleled repeatability and precision to ±2µm on all three axes.
